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Company News
04/30/2026 | 4475
Tweezer Soldering Tips are now in stock: A-1378, A-1380, A-1381, A-1382, A-1383, A-1384, A-1385, A-1388, A-1390, A-1391, A-1392. All tips sold individually or in complete set.
04/27/2026 | 1986
AKTAKOM APS-3320 is a single-channel DC power supply with an adjustable current limit. APS-3320 provides accurate stable DC power with low noise.
04/23/2026 | 2480
The list of useful services for specialists on our website has the latest addition, a new engineering calculator. The Inductive Reactance Calculator, is an easy-to-use tool used for calculating inductive reactance. The resulting calculations can be saved or shared.
04/20/2026 | 923
The Aktakom Com-Terminal program uses COM port to facilitate two-way data exchange with external devices. Aktakom Com-Terminal uses two data formats - text (TXT) and hexadecimal (HEX).
04/16/2026 | 1525
This tool allows you to determine which resistor you should use when you have a single LED or a number of the same color of LEDs in series. It displays resistor value, recommended resistor wattage as well as resistor color coding.
04/15/2026 | 86
04/13/2026 | 780
Aktakom Power Manager Express 3 software allows users to remotely control their power supply via PC. It features Measure, Set Up and Initialization functions, as well as, automatic switching off of the outputs of the device at the end of the program. The program follows basic configurations and some features of operation as the device control panel.
04/09/2026 | 700
Please see the detailed explanation of the term WEEE and how it applies to modern electronics
04/06/2026 | 595
If you have any questions concerning AKTAKOM APS-7306 power supply operation you may check the FAQ tab on this device page where we have added the most frequently asked questions and the respective answers.
04/02/2026 | 671
Soldering is a process in which two or more metal items are joined together by melting a filler metal into the joint. Soldering is used to form a permanent connection between electronic components. Solder is metal alloy usually made of tin and lead which is melted using a hot iron. The iron is heated to temperatures above 600 degrees Fahrenheit which then cools to create a strong electrical bond. Please see Common electronic components repairs and hand soldering techniques for definition of terms and methods used in soldering and desoldering electronic repair. More news |
Deals - Special Offers
Buy 2 APS-3320 Power Supplies and get 20% OFF!
For a limited time, when you purchase two ASE-7306 Power Supplies, you’ll receive 20%.
For a limited time, when you purchase two ASE-1107 stations, you’ll receive 20% OFF. More offers 
Site News
02/13/2026 | 261
Easy-to-use operational amplifier gain calculator is an online engineering tool for engineers, students, and technicians that helps to determine the voltage gain of an operational amplifier.
11/27/2025 | 402
There are many exhibitions and trade shows planned for Winter. To keep you timely informed we have updated “Events” section.
08/13/2025 | 3760
There are 2 new online tools available on our web site: online power bank calculator and current divider calculator…
More news Industry News
05/01/2026 | 15
Rohde & Schwarz is unveiling the latest generation of the gold standard for reliable ATC voice communications: CERTIUM VCS, a game-changing VoIP solution. This new generation offers enhanced resilience, security, and usability for mission-critical voice communication.
04/29/2026 | 49
Global industrial technology leader Emerson announced details of its annual NI Connect conference, being held May 12-14 at the Fort Worth Convention Center under the theme “Productivity Reimagined.” The event brings together engineers, researchers and business leaders across all industries to share the latest advancements in test and measurement automation technology.
04/27/2026 | 47
Keysight Technologies, Inc. introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications.
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