Anritsu demonstrates LTE-Advanced commercial peak data rates of new Intel® XMM™ 7260 platform

Anritsu demonstrates LTE-Advanced commercial peak data rates of new Intel® XMM™ 7260 platform


Anritsu Corporation has announced the successful demonstration of the Intel® XMM™ 7260 device platform achieving LTE-Advanced Category 6 data rates of concurrent 300 Mbps downlink and 50Mbps uplink with carrier aggregation technology, using the Anritsu MD8430A/RTD development test environment.

Network operators are starting the deployment of Carrier Aggregation technology and it is expected that many LTE operators will deploy the technology to provide higher peak data rates, but also to enable more efficient utilization and combining of available spectrum to optimize user experience. For global handset suppliers and leading operators, it is important that devices are able to support the full range of 3GPP configurations up to 40MHz of aggregated bandwidth and concurrent throughput of up to 300 Mbps in downlink and 50Mbps in uplink.

Using the high performance MD8430A signaling tester from Anritsu, together with the RTD advanced test case development and protocol analyzer, Intel has been able to establish an end to end data connection with concurrent 300 Mbps in downlink and 50Mbps in uplink. This requires that both the Signaling tester and device platform are capable to support the LTE-Advanced Carrier Aggregation technology with 20+20 MHz bandwidth. The advanced R&D features and high stability of the MD8430A/RTD enables users to rapidly enable the functionality within the device platform and verify the performance capability. Olaf Sieler, Director of Global Accounts for Anritsu Corporation commented “Anritsu is extremely proud to be at the leading edge of Intel’s device testing, providing our world class test systems and services to enable Intel to rapidly verify the capability of new technologies and devices”.

“Last year, Intel entered the market for multimode LTE. This year, we’re delivering a highly competitive LTE-Advanced experience with our new 7260 platform as demonstrated with Anritsu,” said Aicha Evans, corporate vice president of wireless platform research and development at Intel.

Anritsu will be demonstrating the MD8430A operating at 300Mbps downlink and 50Mbps uplink with Intel’s XMM7260 platform at Mobile World Congress (Barcelona) on booth number 6F40.

Anritsu Corporation,

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