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Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
04/27/2026 Keysight Technologies, Inc. introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect designs for multi-die and stacked-die applications which traditional workflows struggle to handle efficiently. As a result, teams spend significant time manually optimizing the interconnects that include vias, transmission lines, solder balls, and micro-bumps while ensuring signal and power integrity in densely packed systems. This results in more design spins and longer product development cycles, creating a bottleneck that can delay product launches and increase development costs. Keysight EDA software streamlines the process with a dedicated workflow for designing and optimizing 3D interconnects accurately. The tool handles complex geometries, including hatched or waffled ground planes, which are critical to overcome manufacturing and fabrication constraints, especially silicon processes such as interposers and bridges, in advanced package designs. By enabling engineers to quickly design, optimize, and validate 3D interconnects used in chiplets and 3DICs, it minimizes iterations and speeds time-to-market. Key benefits include:
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