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Connect with NI at Aerospace Test & Development Show 2024
08/21/2024 | 221
From September 10-11, 2024, The Aerospace Test and Development Show will bring together manufacturers of aerospace components, complete aircraft, space exploration vessels, urban-and inter-urban passenger drones, and air-defence systems to discuss and showcase technologies, techniques, and services that will reduce product failure, decrease product development cycles and costs, and improve performance and reliability...

Anritsu at IEEE AUTOTESTCON 2024
08/19/2024 | 218
Anritsu invites to attend its booth 431 at IEEE AUTOTESTCON 2024. AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services.

Keysight Introduces Next-Generation Radio Frequency Circuit Simulator for RFIC Chip Designers
08/16/2024 | 348
Keysight Technologies, Inc. introduces RFPro Circuit, a next-generation radio frequency (RF) simulation tool targeting the complex, multi-physics requirements of today's RF integrated circuit (RFIC) designers. Wireless, automotive, and satellite designers can now deliver robust designs that overcome performance challenges in dense 3D packaging, taking advantage of interoperability and automation to form complex workflows.

Rohde & Schwarz and Samsung pave the way for adoption of secure ranging test cases defined by the FiRa Consortium
08/14/2024 | 192
Rohde & Schwarz and Samsung have collaborated to verify secure ranging test cases for the ultra-wideband (UWB) PHY layer and assess the secure receiver characteristics of devices based on FiRa specifications. There are new test cases specified in the FiRa 2.0 Technical Specifications, which covers the prevention of physical layer attacks on secure ranging applications based on UWB technology. These test cases were verified with the R&S CMP200 radio communication tester from Rohde & Schwarz on Samsung’s latest UWB chipset.

Bioprocessing Summit 2024
08/12/2024 | 189
Yokogawa is excited to be a proud sponsor and a part of the 16th Annual Bioprocessing Summit 2024! This summit is a premier opportunity to explore the latest research, share insights with industry pioneers, and drive the future of bioprocessing forward.

NI invites to IEEE AUTOTESTCON 2024
08/09/2024 | 148
NI invites to attend AUTOTESTCON, the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services.

2024 High-voltage Seminars from Texas Instruments
08/07/2024 | 181
From managing complex wide-band gap power topologies to ensuring robust isolation architectures, working with high-voltage systems comes with a unique set of challenges.

Yokogawa invites to join “The Mystery of the Very, Nearly Impossible pH Measurement”
08/05/2024 | 158
Get ready to delve into the intricate world of investigation and deduction. In this session, Yokogawa will explore the art of solving mysteries, uncovering clues, and piecing together evidence to crack the toughest cases. Whether you’re an aspiring sleuth or a seasoned detective enthusiast, you'll gain valuable insights into the techniques and strategies used by the greatest detectives. Join Yokogawa as it embarks on a thrilling journey through the labyrinth of mystery, where every detail matters, and the truth awaits to be uncovered. Get ready to sharpen your observational skills and enhance your deductive reasoning in this engaging and educational webinar. Date: August 22, 2024.

Rohde & Schwarz Expanding EMC Community Capability through their interactive challenge at EMC+SIPI 2024
08/02/2024 | 184
Rohde & Schwarz, leaders in electromagnetic compatibility (EMC) testing, from debugging to full compliance for over 50 years, announced the continuation of their “Are You a Genius” interactive EMC engineering challenge for the 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC + SIPI). Through this live interactive demo, Rohde & Schwarz is offering their technical expertise in EMC to a wide engineering audience.

Webinar by TI “MagPack™ technology: 3 steps ahead with new power modules’ power density, efficiency, and EMI”
07/31/2024 | 219
Fitting more of your functionality into a smaller space, and overcoming the associated thermal challenges of doing so, demands that TI power modules achieve previously-impossible levels of performance.


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