DesignCon 2017

DesignCon 2017
DesignCon, the premier conference for chip, board, and systems design engineers, returns to Silicon Valley for its 22nd year. DesignCon serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities.

Taking place annually, DesignCon remains the largest gathering of chip, board, and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos, and exhibits; DesignCon brings engineers the latest theories, methodologies, techniques, applications, and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components, and more.

Technical Conference
Jan 31 – Feb 2, 2017

With more than 100 sessions spanning 14 tracks, the Technical Conference Program covers all aspects of electronic design; from chips through boards and systems. Get practical solutions to your problems involving:

  • Signal and Power Integrity
  • Mixed-Signal and High-Speed Serial Design
  • Test & Measurement and Verification
  • and more

The Expo
Feb 1-2, 2017

The DesignCon Expo Hall gives you access to 185 exhibitors offering the latest products and technologies in signal integrity and high-speed design for your current and future projects. On the Expo Floor you can:

  • Discover and compare emerging tools and technologies
  • Get practical insights and solutions to your design issues
  • Take part in free education and training in the Chiphead Theater and Vendor Sessions

Plus: Engineer of the Year Awards, prizes and giveaways, speed-trainings, product teardowns, happy hour parties, access to the keynotes and technical panels, and more!

To register click the present link.

Start Date:  01/31/2017
End Date:  02/02/2017
Venue:  Santa Clara, CA, USA; Santa Clara Convention Center
Organizer:  UBM Tech

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