ASE-1112 Temperature Controlled Soldering Station

Soldering iron: Direct contact, ideal for through-hole and simple SMD soldering.

Hot air gun: Non-contact, perfect for SMD component removal, IC reflow, and repairs on dense boards.

Common causes:

• Tip temperature too low or oxidized
• Dirty pad or component leads
• Using wrong flux type or insufficient solder
• Lead-free solder requires slightly higher temperature

A soldering iron is a standalone tool with a fixed power and basic control.
A soldering station provides adjustable temperature, stable power delivery, interchangeable tips, and often includes additional functions like sleep mode or rework tools.

Aktakom soldering stations are designed for precision electronic soldering and repair work.
They allow users to assemble, rework, and desolder electronic components on circuit boards safely and efficiently, with accurate temperature control and ESD-safe performance.

Tip’s temperature High soldering temperatures can degrade the tip. Use the lowest possible soldering temperature. The excellent thermal recovery characteristics ensure efficient and effective soldering event at low temperatures. This also protects the sensitive components from thermal damage. Cleaning Clean the tip regularly with a cleaning sponge, as oxides and carbides from the solder and flux can form impurities on the tip. These impurities can result in defective joints or reduce the tip's heat conductivity. When using the soldering iron continuously, be sure to loosen the tip and remove all oxides least once a week. This helps prevent reduction of the tip temperature. When not in use Never leave the soldering iron sitting at high temperature for long periods of time, as the tip's solder plating will be covered with oxide, which can greatly reduce the tip's heat conductivity. After use Wipe the tip and coat it with fresh solder. This helps to prevent tip oxidation.

A de-tinned tip is one which cannot wet with solder. This exposes the plating to oxidation and degrades the heat transfer efficiency of the tip.

The de-tinning is caused by:

1) Failure to keep the tip covered with fresh solder while not in use.

2) High tip temperatures.

3) Insufficient melting in soldering operations.

4) Wiping the tip on dirty or dry sponges and rags (Always use a clean, wet, industrial grade, sulfur-free sponge).

5) Impurities in the solder, iron plating, or on the surfaces to be soldered.

Caution! Never file the tip to remove oxide. Avoid using abrasive materials.

1. Set the temperature to 250°C.
2. When the temperature stabilizes, clean the tip with the cleaning sponge and check the condition of the tip.
3. If there is black oxide on the solder-plated portion of the tip, apply new solder (containing flux) and wipe the tip on the cleaning sponge. Repeat until the oxide is completely removed. Coat with new solder. The solder protects the tip from oxidation and prolongs the life of the tip.
4. If the tip becomes pitted, blackened, or won’t hold solder, replace it with a new one.

600 - 650°F (316 - 343°C) is a good place to start for lead-based solder and 650 - 700°F (343 - 371°C) for lead-free solder.

Note: if clots form, the temperature is too low. Use the lowest temperature that melts the solder efficiently — excessive heat can damage components or PCB pads.