Leveraging the RF expertise and core microwave technologies developed for Tektronix instruments, Tektronix Component Solutions is announcing two new high-performance microwave modules, the TDRO-900A and TSFB-900A. Originally designed to meet the demanding signal integrity and performance requirements of RF test equipment, these modules enable transmitter and receiver system designers to bring a higher level of precision to aerospace, communications and defense applications. Additionally, these modules are representative examples of Tektronix Component Solutions’ ability to engineer, assemble and test custom RF devices to meet specific requirements. The TDRO and TSFB are available as “off-the-shelf” modules or can be customized to meet unique customer specifications.
“We’re excited to apply our extensive RF and microwave capabilities to solve new component challenges for our customers,” said Tom Buzak, president, Tektronix Component Solutions. “Having the ability to choose from standard components, customized versions of those components, or fully-customized modules to meet RF and microwave needs, provides our customers greater flexibility in the development of their next-generation systems.”
TDRO-900A 9 GHz Dielectric Resonator Oscillator
The TDRO-900A is an instrument-grade 9 GHz oscillator that uses the high-Q property of a dielectric resonator to tightly control the frequency of oscillation. Key features include low single-sideband phase noise performance of -114 dBc/Hz at 10 kHz offset, ±2.5 MHz electrical tuning range around the center frequency of 9 GHz, and high output power of +10 dBm. The TDRO-900A is available in either bench or component configurations, with the bench version providing a base fixture and SMA connector for easy lab use or evaluation.
TSFB-900A 8 – 22 GHz Nine-channel Switched Filter Bank
The TSFB-900A is an instrument-grade, nine-channel switched filter bank module that operates from 8-22 GHz. Each band has a minimum of 1.5 GHz bandwidth and 150 MHz band overlap. The TSFB-900A provides ≥ 80 dBc rejection to 50 GHz for suppression of out-of-band signals. The TSFB-900A includes an interface board that allows for easy control and automation via USB.
About Tektronix Component Solutions
Originally created in 1970 as the Hybrid Components Organization within Tektronix, the group was formed to supply high-performance components for Tektronix high-speed measurement equipment.
In 1994 the organization was spun out as a joint venture between Maxim and Tektronix. As Maxtek, company began to apply its expertise in the design, assembly and test of demanding microelectronics for customers in a variety of industries.
Reacquired by Tektronix in 2000 and renamed Tektronix Component Solutions in 2010, the organization continues to provide a full range of design, assembly and test services to those requiring component performance and reliability for demanding applications.
The headquartered located in Beaverton, Oregon, with additional sites in Orlando, Florida and Phoenix, Arizona.
Tektronix Component Solutions, www.component-solutions.tektronix.com