Texas Instruments showcases innovation in ultra-low power, sub-terahertz wave systems and advanced CMOS technology at VLSI Symposium
Several technologists from Texas Instruments (NASDAQ: TXN) (TI) shared research and insight on semiconductor advancements shaping future applications at the 2012 Symposium on VLSI Technology (June 12-14).
"TI's comprehensive research and development activities were addressing some of the electronic industry's most challenging problems," said Ajith Amerasekera, director of TI's Kilby Labs and the 2012 VLSI Symposium Chair. "Several TI speakers at this year's VLSI Symposium outlined how TI was shaping the power, performance and integration of electronics to enable applications we could only imagine today."
TI's 2012 VLSI Symposium papers or presentations addressed:
- Issues and challenges in Ultra-Low Power wireless communication
- CMOS for implementing sub-terahertz (THz) wave systems
- The impact of through silicon via (TSV) 3D technology on 28-nm CMOS transistor performance
- Interesting challenges faced by advanced node design enablement teams as Moore's Law scaling takes the industry down to the 14-nm technology node
- The performance bottleneck in communications systems, data converter power scaling trends and the analog/digital boundary in future serial links and software defined radio applications.
About innovation at TI
Innovation is the technology thread that runs throughout TI's 80+ year history. Today, TI is driving game-changing technology roadmaps and products in the areas of ultra-low power processing and signal conditioning, energy management, cloud computing, safety and security, medical and more. In collaboration with our customers, industry consortia and universities, TI develops differentiated products that improve how we live, work and play, today and well into the future. Learn more at www.ti.com/innovation.
Texas Instruments Incorporated, www.ti.com
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