DesignCon 2014

Taking place annually in Silicon Valley, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities.

Created by engineers for engineers, DesignCon is the largest gathering of chip, board and systems designers in the world and is focused on the pervasive nature of signal integrity at all levels of electronic design – chip, package, board and system. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test & measurement tools, parallel & memory interface design, ICs, semiconductor components and more.

DesignCon enables chip, board and systems designers, software developers and silicon manufacturers to grow their design expertise, learn about and see the latest advanced design technologies & tools from top vendors in the industry, and network with fellow engineers and design engineering experts.

The 2014 Technical Conference Program will consist of 14 tracks overing all aspects of electronic design, from chips through boards and systems.

Here is what some attendees are saying about DesignCon:

“DesignCon is, hands down, the best conference with respect to value offered in applicable information and technologies in the Signal Integrity field, to be used in our current and next-generation designs.”

“DesignCon is a great place to get exposure to hardware technology, tools and companies, everything from low-level chip technology to high-level integrated systems for measurement and testing that were relevant for a new project.”

For more information and pass registration visit www.designcon.com

Start Date:  01/28/2014
End Date:  01/31/2014
Venue:  Santa Clara, CA, USA; Santa Clara Convention Center
Organizer:  UBM Canon