As brands and developers have been eagerly awaiting a solution that will allow them to create smaller form factor products integrating 1080p projection displays, Texas Instruments (TI) (NASDAQ: TXN) announced its DLP Pico 0.33-inch full-HD chipset. Consisting of the DLP3310 digital micromirror device (DMD) and DLPC3437 controller, this is the industry's smallest 1080p display chip solution with the highest brightness capabilities in the 0.3-inch imager class.
Tektronix, Inc., a leading worldwide provider of measurement solutions, introduced the industry's first receiver test solution with 100 percent coverage of the MIPI Alliance's recently released D-PHY v.2.0 specification along with full support for the C-PHY v1.1 receiver test specification.
Rohde & Schwarz safeguarded Austria's AirPower 2016 air show against the security risk of commercial drones encroaching on the show's airspace. This was accomplished using the R&S ARDRONIS radiomonitoring solution that enables users to identify drone control signals early on, to locate and even stop the drone.
NI (Nasdaq: NATI), the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the opening of the new NI Industrial IoT Lab at its Austin headquarters.
Keysight Technologies, Inc. (NYSE: KEYS) announced it will exhibit its latest high-speed digital solutions at DesignCon 2017, Booth 725, Santa Clara Convention Center, Feb. 1-2. Keysight's technical experts and application engineers will demonstrate the most advanced design and test solutions, developed for solving today's most difficult high-speed digital measurement challenges. Keysight is proud to be the host sponsor of DesignCon 2017.
NI (Nasdaq: NATI), the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the release of its Automated Test Outlook 2017. The annual test and measurement report reviews the key technologies impacting automated test environments from reconfigurable test instrumentation to software-centric test platforms and ecosystems for next-generation device test.
Texas Instruments (TI) introduced the industry's highest-density, 18-V input, 35-A synchronous DC/DC buck converter, which offers full differential remote-voltage sensing and PMBus to support telemetry. TI's TPS546C23 power converter integrates high- and low-side MOSFETs into a small-footprint package that is significantly denser than competitive devices.
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